Apple is in talks with suppliers to manage iPhone chip assembly and packaging in India for the first time, reports The ...

Joint Development Agreement builds on ongoing collaboration with Manz Asia As demand for AI computing accelerates, advances in 12" wafer-level packaging and large-area panel packaging could offer a ...

Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem's (SMTK) advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025. Visit Manz Asia at Booth no.

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%.

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. Packaging: A 30-Year Career Retrospective We’ve come a very ...