AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, ...

For decades, compute architectures have relied on dynamic random-access memory (DRAM) as their main memory, providing temporary storage from which processing units retrieve data and program code. The ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

The Atlas® G6 system delivers smaller spot size, higher signal sensitivity and enhanced precision for next generation gate-all-around and high bandwidth memory device production Onto Innovation Inc.

iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...

Lam Research is poised for long-term growth due to the increasing demand for 3D NAND, DRAM, and logic chips driven by AI adoption. Regardless of concerns over potential revenue loss from China, Lam's ...

NEO Semiconductor has unveiled its "3D X-DRAM", which it is pitching as the world's first 3D NAND-like DRAM cell array. Based on Neo's estimates, 3D X-DRAM technology can achieve 128 Gb density with ...

On June 4, 1968, Robert Dennard was granted a patent for a single transistor, single capacitor DRAM cell design idea. This doesn’t sound earth-shattering today, but back in the sixties, this was a ...

Applied Materials’ AMAT Logic and DRAM businesses are gaining traction on the back of rising demand for AI infrastructure. On fiscal third-quarter 2025 earnings call, AMAT highlighted its leadership ...