“The conga-HPC/mIQ-X takes embedded Arm computing to a new level of performance and simplifies the development of AI-accelerated edge and vision systems through UEFI BIOS support, Windows integration, ...
Embedded module supplier Congatec has unveiled its first COM-HPC Mini modules featuring Qualcomm's Dragonwing IQ-X series ...
A power-module architecture developed by Asahi Kasei and Silicon Austria Labs features Hall-effect sensors, delivering higher accuracy in a compact form factor. Built on a standard PCB using ...
TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that beginning February 15 it will provide samples of its new LV100-type 1.2-kV IGBT module as an industrial-use ...
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