The shift from 12-V supply rails to 48-V power systems is pushing power levels under the hood to new highs. But it opens the ...
Computer-on-Modules (COMs), ensuring Q7 designs remain viable until at least 2034, with an optional extension to 2039. The ...
Abstract: Developing high-temperature and high-voltage SiC power modules requires packaging insulation with better thermal stability and electrical properties at high temperatures. This work studied ...
Abstract: Electrical field (E-field) concentration in the high-voltage power module packaging, which is one of the main causes of packaging failure, is not only highly related to the dielectric ...