Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Inside firms, AI is changing tasks—and, with those tasks, how they hire and organize. Controlled studies show large gains on ...
Abstract: Unmanned Aerial Vehicles (UAVs) are widely adopted across various fields, yet they raise significant privacy and safety concerns, demanding robust monitoring solutions. Existing anti-UAV ...
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