Shenzhen team completed a working prototype of a EUV machine in early 2025, sources say Read more at The Business Times.
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Apple in talks with Indian chipmakers to assemble, package iPhone components: Report
Apple has engaged in early-stage discussions with Indian semiconductor manufacturers to handle the assembly and packaging of ...
In a high-security Shenzhen laboratory, Chinese scientists have built a prototype of a machine capable of producing ...
So, you want to know about metallization in semiconductor chips? It’s basically how we create the tiny metal pathways that ...
Researchers at MIT have developed a new computer chip fabrication method that integrates logic and memory devices to ...
Engineers designing RF systems at millimeter wave frequencies face exponentially increasing challenges as losses compound, ...
Rock-paper-scissors is usually a game of psychology, reverse psychology, reverse-reverse psychology, and chance. But what if ...
The AR Alliance, a division of SPIE focused on augmented reality (AR), proudly announces the addition of Aluvia Photonics, ColorChip Group LTD, Fraunhofer Institute for Photonic Microsystems IPMS, ...
Among semiconductor stocks, Sur named Broadcom (AVGO), Marvell Technology (MRVL), Analog Devices (ADI) and Micron Technology (MU) as his top picks for 2026. His only chip-equipment pick is KLA (KLAC), ...
While previous p-bit proposals included an analog component and DAC, the new research offers an all-digital p-bit design. “The reliance on analog signals was holding back progress,” said Shunsuke ...
Researchers across a handful of institutions say they developed a brain-computer interface (BCI) utilizing a single silicon ...
CMU, Stanford, Penn, MIT, and SkyWater Technology achieved a milestone with the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed ...
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